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[XGNews]: 2021 world semiconductor Conference

The following is the [XGNews]: 2021 world semiconductor Conference recommended by xgapn.com.

On June 9, 2021, the 2021 world semiconductor conference was successfully held in the China hall of Nanjing International Expo Center. The conference is jointly sponsored by China Semiconductor Industry Association, China Electronic Information Industry Development Research Institute, Jiangsu Provincial Department of industry and information technology and Nanjing Jiangbei new area management committee. It is jointly organized by CCID Consulting Co., Ltd., Jiangsu Semiconductor Industry Association, Nanjing Jiangbei new area industrial technology research and Innovation Park and Nanjing runzhan International Exhibition Co., Ltd.

With the theme of “innovation and change, win-win with” core “, Han liming, member of the Standing Committee of Jiangsu provincial Party committee and Secretary of Nanjing municipal Party committee, Qiao Yueshan, director of the electronic information department of the Ministry of industry and information technology, and Zhang Li, President of China Electronic Information Industry Development Research Institute, addressed the conference respectively. Mao Junfa, academician of the Chinese Academy of Sciences, member of the Standing Committee of the Party committee and vice president of Shanghai Jiaotong University; Wu Hanming, academician of the Chinese Academy of engineering and Dean of the school of micro nano electronics of Zhejiang University; Li Jinlong, vice chairman of the ICT group of the European Chamber of Commerce of China; Chris Millward, President of the information industry organization of the United States; Chen Chuanmei, member of the Party Working Committee and deputy director of the Management Committee of Jiangbei new district of Nanjing; senior vice president of AMD Pan Xiaoming, President of Greater China, Zheng Li, vice president of China Semiconductor Industry Association, director and CEO of Changdian technology, Wang Zhongfeng, distinguished professor of Nanjing University, IEEE fellow and chairman of Nanjing FengXing Technology Co., Ltd., and Wang Libin, chairman and CEO of xinhuazhang technology, delivered keynote speeches.

Mao Junfa, academician of the Chinese Academy of Sciences, member of the Standing Committee of the Party committee of Shanghai Jiaotong University and vice president, gave us the keynote speech of “semiconductor heterogeneous integrated circuits”. Starting from the current challenges faced by integrated circuits, academician Mao Junfa focused on the emerging heterogeneous integrated circuit technology, and expounded that at the moment when Moore’s law is facing the ultimate challenge and the turning point is approaching, semiconductor heterogeneous integration will provide historical opportunities for the development of integrated circuits.

Wu Hanming, academician of the Chinese Academy of engineering and Dean of the school of micro nano electronics of Zhejiang University, delivered a keynote speech entitled “challenges and opportunities of chips in the post Moore era”. He pointed out that even though the difficulty and cost of chips have been increasing, the slowing down Moore’s law has brought opportunities to the pursuers. Industrial technology is not the application and development after the transformation of scientific research institutions, but one of the original driving forces to guide scientific research.

A member of the Party Working Committee and deputy director of the Management Committee of Jiangbei new district of Nanjing delivered a keynote speech at the meeting. He pointed out that Jiangbei new district, as a gathering area for the development of integrated circuit industry in Nanjing, focused on “one core and one chain”, has gathered more than 500 integrated circuit enterprises, with a year-on-year growth of 63%. In the future, we will step up the cultivation of characteristic fields of optoelectronic chips, and strive to seize the first opportunity in the future competition of the next generation Internet and high-speed and high-capacity optical fiber communication, so as to realize “overtaking on the curve”.

Pan Xiaoming, senior vice president of AMD and President of Greater China, delivered a keynote speech on the future of computing. He introduced that today’s and future workloads need powerful computing power, and heterogeneous computing is the key future trend. AMD will focus on high-performance computing in the three aspects of computing, graphics and solutions in the future, and maintain the leadership of high-performance computing in the sustainable development industry.

 

Vice chairman of China Semiconductor Industry Association, director and CEO of Changdian Technology Co., Ltd. shared the keynote speech of “breakthrough of advanced chip manufacturing technology in post Moore era”. He said that in the post Moore era, the manufacturing technology and value of semiconductor devices far exceed the scope of packaging and testing. At present, the industrial upgrading trend from advanced packaging to chip manufacturing is obvious, and the two core technologies of Changdian can realize heterogeneous integration. At the same time, collaborative design is very important to optimize the trend of integration and testing of chip products.

 

Wang Libin, chairman and CEO of xinhuazhang technology, brought us the keynote speech of EDA 2.0, new technology and new ecology for the future. He pointed out that the future digital system is deeply integrated by system, chip, algorithm and software. The innovation of system application has produced more customized requirements for chip, and the scientific research paradigm is also undergoing profound changes. Technology companies must research and develop the next generation of EDA 2.0 technology and build a new ecology for the future while doing well in the real product development.

In the afternoon, the 2021 world semiconductor conference · Innovation Summit was successfully held in the China hall of Nanjing International Expo Center. Luo Qun, member of the Standing Committee of Nanjing municipal Party committee and full-time Deputy Secretary of the Party Working Committee of Jiangbei new district, Nanjing, and Guo Yiwu, Secretary General of Shanghai Integrated Circuit Industry Association, addressed the Innovation Summit.

Ju long, global vice president of semi and President of China, shared the keynote speech of “global core shortage: accelerating the restructuring of semiconductor industry chain” at the Innovation Summit. He made an in-depth analysis of the new situation and new challenges of the global semiconductor industry, elaborated the trend of accelerating the restructuring of the semiconductor industry chain layout, and introduced the semiconductor industry association semi, which has a long history.

Su Hua, senior vice president of Infineon technology worldwide and President of Greater China region, shared the keynote speech of “gathering power, seeking innovation, creating change and win-win situation”. He focused on Infineon’s solutions in future travel, Internet of things and energy efficiency related fields.

George Andy, President of Bosch Automotive Electronics in China, delivered the keynote speech of “embracing China’s” core “era”. He focused on Bosch’s semiconductor solutions in automotive and consumer electronics applications.

Guo Guiguan, deputy general manager of Sunmoon group, shared the keynote speech of “development trend of heterogeneous integration in the new era”. He shared that with the increasing complexity of chips, testing is more time-consuming and labor-consuming, and using different packaging technologies for heterogeneous chip integration is the development trend of the new era.

Wang Zhongfeng, distinguished professor of Nanjing University, IEEE fellow and chairman of Nanjing FengXing Technology Co., Ltd., gave a keynote speech entitled “design of high energy efficiency neural network accelerator for adapting random sparsity”. He focused on the principle and related circuit design of AI accelerator, as well as the application of AI accelerator in different fields.

Li Ke, vice president of CCID Consulting Co., Ltd., delivered the keynote speech of “2021 global semiconductor market trend outlook”. Mr. Li Ke pointed out that the emerging application scenarios will have a huge driving effect on the formation of a new development pattern of China’s IC industry. At the same time, the disruptive technologies of new materials and new architecture will become the main choices of the IC industry in the post Moore era. In the future, the whole machine manufacturers will accelerate the process of self-developed chips.

At the end of the meeting, the “top ten characteristic parks for high-quality development of integrated circuits in China and the first top 100 IC enterprises value list” was announced. Dr. Teng ran, director of integrated circuit center of CCID Consulting Co., Ltd., released the list of “top ten parks and 100 enterprises”, and analyzed the construction of the evaluation system.

The exhibition covers an area of 15000 square meters, covering chip design area, wafer manufacturing area, packaging and testing area, semiconductor equipment and materials area, government organization area, industrial park and other areas. More than 300 enterprises from Changdian technology, Infineon, Huatian, etc. have signed up for the exhibition. At the same time, the Organizing Committee of the world semiconductor conference continues to provide exhibition and supply and demand docking services for enterprises through the online exhibition service platform of “world semiconductor Conference on cloud”. The live broadcast platform of semiconductor Conference on cloud has attracted more than one million viewers, and excellent enterprises have been exposed more than 100000 times.

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