The following is the [XGNews]: Taiwan media: fabless and partners strengthen 5g RF front-end module deployment recommended by xgapn.com.
Industry sources said that fabless chip manufacturers are seeking to strengthen the deployment in 5g RF front-end module (RF FEM) and other equipment markets through close cooperation with manufacturing partners.
According to DIGITIMES, the source said that the major chip suppliers of RF FEM, including Qualcomm, qorvo and skyworks, have their own ecosystem partners, including wafer foundry and packaging and testing plant, in order to expand their influence in the 5g RF chip market. For packaging and testing manufacturers, orders for system level packaging (SIP) technology for handling 5g RF FEM will surge.
For example, Vanchip Technologies, a subsidiary of MediaTek, will cooperate with GaAs generation to meet the needs of Chinese mainland suppliers for 5G mobile phone. Wenmao is also a contract manufacturer of Qualcomm 5g sub-6ghz power amplifier (PA).
It is reported that another foundry partner of Qualcomm is Hongjie technology, and its 6-inch wafer manufacturing line has been certified by chip suppliers. At the same time, Qualcomm also strengthened its partnership with lattice core to expand its cooperation in 5g RF front-end products. Lattice core recently revealed that the cooperation includes sub-6ghz and cutting-edge mmwave technology.
In addition, the report points out that in the 5g era, major packaging and testing manufacturers such as rimoonlight, Amkor and Changdian technology have turned to heterogeneous integration technologies such as SIP and antenna packaging (AIP).
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